Actualités
Afficher l'aperçu des nouvelles
FIS Unites Commerce and Logistics at the LogiMAT/TradeWorld 2017 Fair – and Goes Cloud
16.01.2017
The combination of commerce and intralogistics under the common roof of the LogiMAT/TradeWorld 2017 fair represents the networking and the integration of processes under the motto of »digital transformation«.
FIS already unites both worlds in its portfolio and presents itself with its full range of commercial and logistical solutions and services at the LogiMAT/TradeWorld 2017 fair, among which are two new developments with one of them coming out of the cloud.
Apart from its well-known ERP and (wholesale) trade expertise, FIS also offers know-how in intralogistics and supply chain integration. The presented solutions combine the processes and technology of the world of ERP, commerce and logistics. Among these are flexible and individual solutions for the connection of external warehouse management systems to SAP. Moreover, FIS/ewm+ celebrates its exhibition premiere. The project implementation turbo enables you to start your warehouse management with SAP EWM (Extended Warehouse Management) quickly and cost-efficiently due to the preconfigured service and functional scope based on best practice processes. Investment security is ensured by continued devel-opment and optimization of the solution.
FIS-iLog GmbH, introducing its iRetPlat (integrated Returnable system Platform) solution for the first time to the fair audience, will also be present at stand D43 in hall 6. This is a new kind of cloud platform for the management of reusable transport packagings (RTP). The un-derlying idea of a digital logistics collaboration will celebrate its market launch under the name of »iRetPlat« in January 2017. In his lecture »Digital logistics collaboration – a (r)evolutionary cloud platform for anyone involved in logistics«, Johannes Weigand, managing director of FIS-iLog GmbH, will explain how logistics players in the RTP management can save 20-30% or more of the usual process costs. The lecture is held at 12.30 pm at Forum T in hall 6 on March 15, 2017.